本文選題：Mo-Cu合金 + 化學鍍　； 參考：《鄭州大學》2015年碩士論文

【摘要】：Mo-Cu合金是一種假性合金,由具有高熔點、低熱膨脹系數(shù)的Mo和高導電性、高導熱性的Cu組成,該合金兼顧了二者的優(yōu)點。Mo-Cu合金具有性能穩(wěn)定,耐燒蝕和致密度高的優(yōu)點,廣泛應用于電子封裝材料、熱沉材料以及航天航空精密儀器零部件,發(fā)展前景廣闊。本文通過化學鍍法制備Mo-Cu復合粉末,利用液相燒結制備Mo-Cu合金,對預處理工藝、化學鍍工藝和燒結工藝進行了探討,通過優(yōu)化工藝參數(shù)制備出具有高致密性和高導電率的復合材料。通過本課題的研究,不僅可以為性能良好的Mo-Cu合金的制備找到一種很好的方法,也為其大批量的生產(chǎn)和廣泛的使用提供強有力的保障。Mo粉預處理包括粉末的分散、除油、粗化、敏化和活化五步,提高了Mo粉表面活性,減少了復合粉末團聚現(xiàn)象,大大提高了Mo粉與Cu的結合性能,有利于化學鍍的實施。通過對化學鍍工藝參數(shù)進行探討,最終確定試驗采用的化學鍍方案:穩(wěn)定劑2,2'-聯(lián)吡啶的濃度為20 mg/L,還原劑甲醛含量24 ml/L,主鹽五水硫酸銅的含量為15-20 g/L,p H值為11.5,水浴溫度為50℃,絡合劑采用乙二酸四乙酸二鈉和酒石酸鉀鈉組成的雙絡合劑系統(tǒng),轉速為40 r/s。通過對燒結工藝進行探討,確定燒結溫度1150℃,保溫90 min。燒結溫度對合金的顯微組織、致密度、顯微硬度和導電性都有顯著的影響。對燒結工藝進行優(yōu)化后,Mo-Cu合金顯微組織呈網(wǎng)狀結構,致密均勻,沒有明顯的缺陷;致密度達到96.1%;導電率為44.56%(IACS),導電性能良好;合金的硬度值為179.2 HV。對Mo-Cu合金液相燒結后發(fā)現(xiàn)隨著溫度的升高,合金的致密度、顯微硬度、導電率都是呈上升趨勢,顯微組織也逐漸呈現(xiàn)網(wǎng)狀結構。這是由于Cu的流動能力增強,Cu在毛細管力的作用下填充合金中的孔隙,降低了合金中孔隙的數(shù)量。但當溫度超過1150℃,合金的各項性能指標都在下降。這是因為Cu的流動性較強向外溢出,合金內(nèi)部出現(xiàn)孔洞。
[Abstract]:Mo-Cu alloy is a pseudo-alloy, which consists of Mo with high melting point, low thermal expansion coefficient and Cu with high electrical conductivity and high thermal conductivity. The Mo-Cu alloy has the advantages of stable properties, high ablation resistance and high density. Widely used in electronic packaging materials, heat sink materials and aerospace precision instrument parts, development prospects. Mo-Cu composite powder was prepared by electroless plating. Mo-Cu alloy was prepared by liquid phase sintering. The pretreatment process, electroless plating process and sintering process were discussed. The composites with high compactness and high conductivity were prepared by optimizing the process parameters. Through the research of this subject, not only can we find a good method for the preparation of Mo-Cu alloy with good properties, but also provide a strong guarantee for its mass production and extensive use. The pretreatment of Mo powder includes powder dispersion, deoiling and coarsening. The surface activity of Mo powder was improved, the agglomeration of composite powder was reduced, the binding property of Mo powder and Cu was greatly improved, and the electroless plating was beneficial to the implementation of electroless plating. Through discussing the technological parameters of electroless plating, the final scheme of electroless plating was determined: the concentration of stabilizer 2O2-bipyridine was 20 mg / L, the formaldehyde content of reductant was 24ml / L, the content of copper sulfate pentahydrate was 15-20 g / L (H = 11.5g / L), the water bath temperature was 50 鈩，

本文編號：2000432