本文選題：類金剛石薄膜 + 金屬摻雜��； 參考：《南京理工大學(xué)》2015年碩士論文

【摘要】：類金剛石(DLC)薄膜是含有金剛石結(jié)構(gòu)(sp3)的非晶碳膜,它具有許多與金剛石薄膜類似的性能。但是,膜層的內(nèi)應(yīng)力過大,嚴(yán)重限制了薄膜的實際應(yīng)用。因此,本課題采用金屬摻雜或引入過渡層的方法制備基于DLC的金屬復(fù)合薄膜,研究其結(jié)構(gòu)、形貌及力學(xué)性能的變化。采用脈沖陰極電弧蒸發(fā)法制備DLC薄膜。結(jié)果表明,脈沖頻率的變化可以顯著改變DLC薄膜中碳sp2團簇的尺寸和有序度等微結(jié)構(gòu),從而導(dǎo)致薄膜中sp3/sp2相對比例的變化。隨著脈沖頻率的增加,薄膜的表面粗糙度降低,而硬度和內(nèi)應(yīng)力增加。此外,DLC薄膜在可見光區(qū)域具有比較高的透光率,隨著脈沖頻率的增加,薄膜的透光率顯著降低。通過直流磁分離和脈沖陰極電弧雙激發(fā)源等離子體方法制備高含量Ti(或Cu)合金化DLC薄膜。結(jié)果表明,Ti合金化DLC薄膜中含有硬質(zhì)相TiC,而Cu原子不與C原子形成化學(xué)鍵。退火處理前,隨著薄膜中金屬含量的增加,兩種合金化薄膜的硬度都降低,Ti摻雜的DLC膜內(nèi)應(yīng)力基本不變,而Cu合金化DLC膜內(nèi)應(yīng)力急劇下降。退火處理后,兩種薄膜的內(nèi)應(yīng)力均減小5倍以上。采用雙激發(fā)源陰極電弧蒸發(fā)法制備具有不同相對厚度的納米級的Cr/DLC雙層膜。結(jié)果表明,隨著Cr夾層和碳層厚度的變化,Cr/DLC雙層膜中碳sp2團簇的尺寸和有序度會受到相應(yīng)影響。保持碳層的厚度為80nm,當(dāng)Cr夾層的厚度達(dá)到12-20nm時,雙層膜的硬度最大。隨著Cr夾層厚度的增加,雙層膜的內(nèi)應(yīng)力降低,當(dāng)Cr夾層厚度超過45nm時,膜內(nèi)應(yīng)力不變。對于Cr夾層厚度為20nm的雙層膜來說,當(dāng)碳層的厚度超過65～106 nm時,Cr夾層的存在不會對Cr/DLC雙層膜的微結(jié)構(gòu)造成影響。此外,Cr夾層的引入可以在一定程度上減小薄膜的摩擦系數(shù)和增加薄膜在可見光區(qū)域的透過率。
[Abstract]:Diamond-like carbon (DLC) films are amorphous carbon films with diamond structure (sp3), which have many properties similar to those of diamond films. However, the internal stress of the film is too large, which seriously limits the practical application of the film. Therefore, metal composite thin films based on DLC were prepared by metal doping or transition layer, and the changes of structure, morphology and mechanical properties were studied. DLC thin films were prepared by pulsed cathode arc evaporation. The results show that the change of pulse frequency can significantly change the size and order of carbon sp2 clusters in DLC films, which leads to the change of the relative proportion of sp3/sp2 in the films. With the increase of pulse frequency, the surface roughness of the film decreases, while the hardness and internal stress increase. In addition, DLC films have high transmittance in the visible region, and the transmittance decreases with the increase of pulse frequency. High content Ti (or Cu) alloyed DLC thin films were prepared by DC magnetic separation and pulsed cathode arc double excitation source plasma. The results show that Ti alloyed DLC films contain hard phase tic, while Cu atoms do not form chemical bonds with C atoms. Before annealing, with the increase of metal content in the films, the hardness of the two kinds of alloyed films decrease the stress of Ti doped DLC films almost unchanged, while the stresses of Cu alloyed DLC films decrease sharply. After annealing, the internal stresses of both films were reduced by more than 5 times. Nano-scale Cr/DLC bilayer films with different relative thickness were prepared by double excitation source cathodic arc evaporation method. The results show that the size and order of carbon sp2 clusters in Cr / DLC bilayer films are affected with the change of Cr intercalation and carbon layer thickness. The thickness of carbon layer is kept at 80 nm. When the thickness of Cr interlayer reaches 12-20nm, the hardness of bilayer film is the highest. With the increase of Cr interlayer thickness, the internal stress of the bilayer film decreases. When the Cr interlayer thickness exceeds 45nm, the inner stress of the bilayer film remains unchanged. For the bilayer film with Cr interlayer thickness of 20nm, when the thickness of carbon layer is more than 65 ~ 106nm, the existence of Cr interlayer will not affect the microstructure of Cr/DLC bilayer film. In addition, the introduction of Cr interlayer can reduce the friction coefficient of the film and increase the transmittance of the film in the visible region to a certain extent.
【學(xué)位授予單位】：南京理工大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TB383.2

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