發(fā)布時間：2018-04-28 03:42

  本文選題：Si + O_　； 參考：《絕緣材料》2017年06期

【摘要】：采用Si O_2與聚酰胺酸復合,制備了具有爽滑性的聚酰亞胺(PI)薄膜,對薄膜的拉伸強度、斷裂伸長率、動摩擦因數(shù)等性能進行測試分析,并采用SEM、TMA和TGA對薄膜進行表征。結(jié)果表明:未添加Si O_2的PI薄膜表面光滑,動摩擦因數(shù)為0.568,薄膜卷起后無爽滑性,容易產(chǎn)生粘連。加入Si O_2后,Si O_2可在PI薄膜表面形成弧形凸起,使動摩擦因數(shù)下降,爽滑性提高。當加入平均粒徑為1.5μm、質(zhì)量分數(shù)為0.1%~0.8%的Si O_2粒子時,隨著Si O_2質(zhì)量分數(shù)的增加,PI薄膜的拉伸強度和斷裂伸長率不斷增大,熱膨脹系數(shù)緩慢降低,耐熱性增加,動摩擦因數(shù)為0.423~0.377,可避免PI薄膜在生產(chǎn)應用過程中出現(xiàn)粘連問題。
[Abstract]:Polyimide (Pi) thin films with smooth properties were prepared by SiO2 and polyamide acid. The tensile strength, elongation at break and friction coefficient of the films were tested and analyzed. The films were characterized by SEM-TMA and TGA. The results show that Pi thin films without SiO2 have smooth surface and dynamic friction coefficient of 0.568. After the addition of Sio _ 2, arc protrusions can be formed on the Pi film surface, resulting in the decrease of the dynamic friction coefficient and the improvement of the smoothness. When the average particle size is 1.5 渭 m and the mass fraction of Sio _ 2 is 0.1%, the tensile strength and elongation at break of Pi films increase with the increase of mass fraction of Sio _ 2, the thermal expansion coefficient decreases slowly and the heat resistance increases. The dynamic friction coefficient is 0.423 ~ 0.377.It can avoid the adhesion of Pi film in the process of production and application.
【作者單位】： 桂林電器科學研究院有限公司;
【基金】：桂林市科學研究與技術(shù)開發(fā)計劃項目(2016010705)
【分類號】：TB383.2;TQ317

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