本文選題：PEDOT + 石墨烯微片��； 參考：《哈爾濱工業(yè)大學(xué)》2016年碩士論文

【摘要】：導(dǎo)電聚苯胺因其具有多重導(dǎo)電態(tài)、獨(dú)特的摻雜機(jī)制和較低的熱導(dǎo)率,成為聚合物熱電材料的研究熱點(diǎn)。通過酸摻雜、與聚合物、碳材料復(fù)合等方法,都能使聚苯胺的導(dǎo)電性能得到提升,并且保持低的熱導(dǎo)率,從而使聚苯胺的熱電性能得到提升。本文通過向聚苯胺中加入聚3,4-乙烯二氧噻吩修飾的石墨烯微片(PEDOT-GN)作為導(dǎo)電填料,研究了PEDOT:GN的比例和PEDOT-GN加入量對(duì)聚苯胺復(fù)合材料熱電性能的影響,并考察了摻雜酸的性質(zhì)對(duì)聚苯胺復(fù)合材料的結(jié)構(gòu)形貌及熱電性能的影響。石墨烯微片易團(tuán)聚,在其表面修飾聚3,4-乙撐二氧噻吩:聚苯乙烯磺酸(PEDOT:PSS)可提高石墨烯微片在聚苯胺基體中的分散性。掃描電鏡照片顯示,PEDOT:PSS納米線及PEDOT納米點(diǎn)修飾在石墨烯微片上或橋接于石墨烯微片之間,構(gòu)筑了大量多維導(dǎo)電網(wǎng)絡(luò)。加入PEDOT修飾的石墨烯微片后,由XRD圖可知,復(fù)合材料的結(jié)晶性變好;由紅外光譜、拉曼光譜可知,復(fù)合材料內(nèi)部未生成新的化學(xué)鍵。由熱失重曲線可知,加入PEDOT-GN后,復(fù)合材料的熱穩(wěn)定性增加,說明PEDOT-GN可減降低聚苯胺脫摻雜的程度。硫酸作為摻雜酸時(shí)聚苯胺包覆的聚3,4-乙烯二氧噻吩修飾的石墨烯微片(記為PEDOT-GN@PANS)復(fù)合材料在所測(cè)試范圍內(nèi)的熱穩(wěn)定性最好。摻雜酸為鹽酸和磺基水楊酸時(shí)對(duì)PEDOT:PSS中PSS的脫去效果較好。研究了摻雜酸為硫酸,導(dǎo)電劑PEDOT-GN的PEDOT:GN比例和加入量對(duì)聚苯胺復(fù)合材料熱電性能的影響。研究表明,加入PEDOT-GN后,復(fù)合材料的電導(dǎo)率在測(cè)試范圍內(nèi)隨PEDOT和PEDOT-GN含量的增加而增大,其中,當(dāng)PEDOT與GN的比例為1:2時(shí),加入量為20%的試樣電導(dǎo)率最高,在180℃時(shí)可達(dá)1956 S/cm,比聚苯胺提高了30倍;復(fù)合材料的Seebeck系數(shù)在測(cè)試范圍內(nèi)的溫度穩(wěn)定性均比聚苯胺好,且隨著PEDOT和PEDOT-GN含量的增加而改善;雖然復(fù)合材料的熱導(dǎo)率隨著PEDOT:GN比例和PEDOT-GN加入量的增加而增大,但其熱導(dǎo)率仍在0.4 W/(m·K)以下。當(dāng)PEDOT:GN=1:2、PEDOT-GN=20%時(shí),復(fù)合材料的熱電性能最好,其ZT值可達(dá)1.26×10-3(180℃),比未加PEDOT-GN的聚苯胺提高了12.6倍。另外,研究了鹽酸、磺基水楊酸、鹽酸-磺基水楊酸混酸、硫酸-磺基水楊酸混酸對(duì)聚苯胺復(fù)合材料熱電性能的影響。研究表明,鹽酸-磺基水楊酸為摻雜酸時(shí),聚苯胺復(fù)合材料熱電性能的改善最顯著,當(dāng)測(cè)試溫度為180℃時(shí),其ZT值可達(dá)2.38×10-3,是PEDOT-GN@PANS復(fù)合材料的3.7倍。
[Abstract]:Conductive Polyaniline has become the research hotspot of polymer thermoelectric materials because of its multi-conducting state, unique doping mechanism and low thermal conductivity.The conductivity of Polyaniline can be improved and the thermal conductivity of Polyaniline can be improved by means of acid doping, polymer and carbon composite, so that the thermoelectric properties of Polyaniline can be improved.In this paper, the effect of the ratio of PEDOT:GN and the amount of PEDOT-GN on the thermoelectric properties of Polyaniline composites was studied by adding PEDOT-GNN as conductive filler.The influence of the properties of doped acid on the morphology and thermoelectric properties of Polyaniline composites was investigated.Graphene microchips are easy to agglomerate, and the surface modification of poly (3o 4-ethylenedioxythiophene): polystyrene sulfonic acid (PEDOT: PSS) can improve the dispersity of graphene microchips in Polyaniline matrix.Scanning electron microscope (SEM) photos show that PEDOT: PSS nanowires and PEDOT nanowires are modified on graphene microchips or bridged between graphene microchips, and a large number of multi-dimensional conductive networks have been constructed.With the addition of PEDOT modified graphene microchips, the crystallinity of the composites was improved by XRD, and no new chemical bonds were formed in the composites by IR and Raman spectra.The thermogravimetric curves show that the thermal stability of the composites increases with the addition of PEDOT-GN, which indicates that PEDOT-GN can reduce the degree of dedoping of Polyaniline.Polyaniline coated graphene microchip (PEDOT-GNPANSs) with polyaniline coating as doping acid has the best thermal stability in the tested range.When the doped acid is hydrochloric acid and sulfosalicylic acid, the removal effect of PSS in PEDOT:PSS is better.The effects of PEDOT:GN ratio of conductive agent PEDOT-GN and doping acid as sulfuric acid on the thermoelectric properties of Polyaniline composites were studied.The results show that the conductivity of the composites increases with the increase of PEDOT and PEDOT-GN content in the test range after the addition of PEDOT-GN. When the ratio of PEDOT to GN is 1:2, the conductivity of the composites with 20% addition is the highest.The Seebeck coefficient of the composite is better than that of Polyaniline at 180 鈩，

本文編號(hào)：1759789