氧化石墨烯的功能化及其環(huán)氧樹(shù)脂復(fù)合材料的制備與性能研究
發(fā)布時(shí)間:2018-03-20 15:52
本文選題:氧化石墨烯 切入點(diǎn):功能化 出處:《華南理工大學(xué)》2015年碩士論文 論文類型:學(xué)位論文
【摘要】:本文以三聚氯氰(TCT)、己二胺(HDM)和4,4′-二氨基二苯基甲烷(DDM)為原料,通過(guò)調(diào)控溫度合成出兩種帶有四個(gè)碳氯鍵的高活性分子TCTHDM和TCTDDM,采用傅立葉紅外、核磁共振的方法對(duì)合成產(chǎn)物進(jìn)行了結(jié)構(gòu)表征。然后以氧化石墨烯(GO)為前驅(qū)體,通過(guò)一步法在表面分別接枝上兩種有機(jī)小分子TCTHDM和TCTDDM,成功制備出兩種功能化氧化石墨烯(TCTHDM-GO和TCTDDM-GO),通過(guò)紅外光譜、拉曼光譜、X射線衍射、掃描電子顯微鏡分析了功能化氧化石墨烯的結(jié)構(gòu)和表面形貌,通過(guò)熱失重分析探究了其熱穩(wěn)定性,并對(duì)兩種功能化氧化石墨烯的分散性進(jìn)行了探討。在接枝上兩種小分子后,石墨烯的熱穩(wěn)定性比氧化石墨烯有了提高,片層之間由于引入了有機(jī)小分子,無(wú)序性和層間距都有所增大。采用非等溫DSC法研究了功能化氧化石墨烯對(duì)環(huán)氧樹(shù)脂固化行為的影響,隨著石墨烯添加量的增大,固化體系達(dá)到最大熱釋放速率的溫度越低,固化體系總釋放熱也越少,而在同一溫度下所對(duì)應(yīng)的轉(zhuǎn)化率卻越高,分別通過(guò)Kissinger和Ozawa兩種方法計(jì)算了固化反應(yīng)的活化能,發(fā)現(xiàn)比純環(huán)氧樹(shù)脂的低,說(shuō)明功能化氧化石墨烯的加入對(duì)環(huán)氧樹(shù)脂的固化行為有一定的催化作用。通過(guò)熱失重分析發(fā)現(xiàn),功能化氧化石墨烯不會(huì)改變兩種復(fù)合材料體系的熱分解歷程。利用DMA法研究了在不同功能化氧化石墨烯含量下兩種固化體系TCTHDM-GO/Epoxy和TCTDDM-GO/Epoxy的儲(chǔ)能模量、損耗因子和玻璃化轉(zhuǎn)變溫度的變化,發(fā)現(xiàn)添加一定量的TCTHDM-GO和TCTDDM-GO能促進(jìn)環(huán)氧樹(shù)脂交聯(lián),提高環(huán)氧樹(shù)脂基體的儲(chǔ)能模量及玻璃化轉(zhuǎn)變溫度。當(dāng)添加TCTHDM-GO的質(zhì)量分?jǐn)?shù)為1.4%時(shí)的復(fù)合材料,其儲(chǔ)能模量達(dá)到最大,提高了0.475GPa,而當(dāng)質(zhì)量分?jǐn)?shù)為1.0%時(shí),玻璃化轉(zhuǎn)變溫度出現(xiàn)極大值,為168.2℃。對(duì)于TCTDDM-GO的環(huán)氧樹(shù)脂復(fù)合材料,儲(chǔ)能模量在質(zhì)量分?jǐn)?shù)為1.0%處達(dá)到最大值,在質(zhì)量分?jǐn)?shù)為1.4%時(shí),玻璃化轉(zhuǎn)變溫度出現(xiàn)極大值,提高了6.5℃。最后,對(duì)復(fù)合材料的力學(xué)性能進(jìn)行了測(cè)試分析,發(fā)現(xiàn)少量的功能化氧化石墨烯的加入可提高復(fù)合材料的力學(xué)性能,拉伸強(qiáng)度最大提升了43%,彎曲強(qiáng)度最大提升了24%,抗沖擊強(qiáng)度最大提升了111%。
[Abstract]:In this paper, two kinds of highly active molecules (TCTHDM and TCTDDM) with four carbon-chlorine bonds were synthesized by controlling temperature by using trimelamine, hexanediamine (HDM) and 4Amino-diphenylmethane (DDM) as raw materials, and Fourier transform infrared spectroscopy (FT-IR) was used. The synthesized products were characterized by NMR. Then graphene oxide (GOO) was used as the precursor. Two kinds of functional graphene oxide (TCTHDM-GO) and TCTDDM-GOA (TCTDDM-GOA) were successfully prepared by one-step grafting of two kinds of organic small molecules (TCTHDM and TCTDDM) on the surface, respectively. The two kinds of functionalized graphene oxide TCTHDM-GO and TCTDDM-GOA were prepared by IR, Raman spectra and X-ray diffraction. The structure and surface morphology of functionalized graphene oxide were analyzed by scanning electron microscope (SEM). The thermal stability of functional graphene oxide was investigated by thermogravimetric analysis. The thermal stability of graphene is better than that of graphene oxide. The influence of functionalized graphene oxide on the curing behavior of epoxy resin was studied by non-isothermal DSC method. With the increase of the amount of graphene, the temperature at which the maximum heat release rate of the curing system reached the maximum heat release rate was lower. The lower the total heat release of curing system is, the higher the corresponding conversion is at the same temperature. The activation energy of curing reaction is calculated by Kissinger and Ozawa, respectively, and it is found that the activation energy of curing reaction is lower than that of pure epoxy resin. The results show that the addition of functionalized graphene oxide can catalyze the curing behavior of epoxy resin. The thermal decomposition mechanism of the two composites was not changed by functionalized graphene oxide. The storage modulus of TCTHDM-GO/Epoxy and TCTDDM-GO/Epoxy in two curing systems with different content of graphene oxide were studied by DMA method. With the change of loss factor and glass transition temperature, it is found that adding a certain amount of TCTHDM-GO and TCTDDM-GO can promote the crosslinking of epoxy resin, improve the storage modulus and glass transition temperature of epoxy resin matrix. The storage modulus reached the maximum, increased by 0.475 GPA, and the glass transition temperature reached the maximum of 168.2 鈩,
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