本文關(guān)鍵詞： 三維打印 石膏基 后處理液 聚氨酯熱熔膠粉　出處：《華南理工大學》2015年碩士論文　論文類型：學位論文

【摘要】：三維打印快速成型技術(shù)是一種采用噴墨印刷技術(shù)與粉末材料作用的快速成型技術(shù)。具有材料廣泛、成型過程簡單、無污染、可打印彩色模具等優(yōu)點,可應(yīng)用于工業(yè)模具、醫(yī)學、建筑等領(lǐng)域。本文研制了一種可用于3DP技術(shù)的石膏基粉末配方。選取石膏作為粉末成型材料的主要成分,選用Si O2粉末對其進行混合改性,改善了石膏粉末的分散性,提高了鋪粉效果;采用均勻設(shè)計試驗得到了石膏基粉末的優(yōu)化配方為:石膏83.7%,PVA 12.6%,二氧化硅0.5%,氧化鋁3.2%。使用該粉末,與水基粘結(jié)液配合上機打印,打印過程流暢,打印器件抗壓強度為1.95 MPa。同時,總結(jié)了在研究粉末打印成型過程中遇到的問題,并對打印器件出現(xiàn)的缺陷及其原因進行了分析。由于打印器件機械強度不佳,本文提出通過浸泡后處理A、B液的方法來提高打印器件性能。并分析了不同的填充強化劑(后處理A液),不同的后處理B液基料,后處理B液中水性環(huán)氧乳液的摻量及后處理液浸泡時間對石膏基打印器件的耐水性、抗壓強度、尺寸偏差、表面微觀結(jié)構(gòu)的影響。后處理A、B液最佳浸泡時間分別為130 s和35 s;先浸泡后處理A液,后浸泡后處理B液的打印器件具有抗壓強度高、吸水率小、表面較光滑、不脫粉等優(yōu)良性能。最后,本文對石膏-聚氨酯基粉末進行了探索研究,分析了成型粉末中熱塑性聚氨酯熱熔粉的添加量對打印器件表面結(jié)構(gòu)、尺寸偏差、密度、孔隙率、吸水率及機械強度的影響。結(jié)果表明TPU粉含量從20%增加到70%,打印器件的密度從2.12 g/cm3降低到1.38 g/cm3;孔隙率從32.5%減少到16.7%;打印器件抗壓強度從1.82 MPa先有較小的降低,后增加至3.74 MPa,拉伸強度從0.22 MPa增加到1.35 MPa。
[Abstract]:3D printing rapid prototyping is a kind of rapid prototyping technology which uses inkjet printing technology and powder material. It has the advantages of wide material, simple molding process, no pollution, color printing mould and so on. It can be used in industry mould, medicine, etc. In this paper, a gypsum powder formula for 3DP technology was developed. Gypsum was selected as the main component of powder forming material, and Sio 2 powder was mixed to modify the powder, which improved the dispersion of gypsum powder. The optimized formula of gypsum based powder is: gypsum 83.7% PVA 12.66, silica 0.5, alumina 3.2%. The powder is printed with water-based binder, and the printing process is smooth. The compressive strength of the printing device is 1.95 MPA. At the same time, the problems encountered in the study of powder printing molding are summarized, and the defects of the printing device and its causes are analyzed. In this paper, we propose a method to improve the performance of printing devices by soaking and treating AZB solution, and analyzing different filling and strengthening agents (post-treatment A liquid, different post-treated B liquid base material, etc.). The content of waterborne epoxy emulsion in post-treatment B solution and the soaking time of post-treatment liquid to the water resistance, compressive strength and dimension deviation of gypsum based printing device, The effect of surface microstructure on the surface microstructure. The optimum immersion time of post-treated AZB solution was 130s and 35s, respectively. The printing device with first soaking and then treated B solution had high compressive strength, low water absorption and smooth surface. Finally, this paper studies the gypsum-polyurethane based powder, and analyzes the effect of the amount of thermoplastic polyurethane hot melt powder on the surface structure, dimension deviation, density, porosity of the printing device, and the effect of the content of the thermoplastic polyurethane hot melt powder on the surface structure, dimension deviation, density, porosity, etc. The results show that the density of printing devices decreases from 2.12 g / cm ~ 3 to 1.38 g / cm ~ (3), the porosity decreases from 32.5% to 16.7, and the compressive strength of printing devices decreases from 1.82 MPa to 1.82 MPa, the results show that the content of TPU powder increases from 20% to 70 and the density of printed devices decreases from 2.12 g / cm ~ 3 to 1.38 g / cm ~ (3). The tensile strength increased from 0.22 MPa to 1.35 MPA.
【學位授予單位】：華南理工大學
【學位級別】：碩士
【學位授予年份】：2015
【分類號】：TB383.3;TP391.73

【參考文獻】

相關(guān)期刊論文 前6條

1 錢超;孫健;;快速成型技術(shù)在口腔修復(fù)中的應(yīng)用[J];國際口腔醫(yī)學雜志;2012年03期

2 吳偉輝;楊永強;來克嫻;;選區(qū)激光熔化快速成型過程分析[J];華南理工大學學報(自然科學版);2007年03期

3 孫智強;;我國3D打印產(chǎn)業(yè)發(fā)展現(xiàn)狀及前景展望[J];江蘇科技信息;2014年06期

4 吳李國;PVA纖維的應(yīng)用現(xiàn)狀及進展[J];現(xiàn)代紡織技術(shù);2001年04期

5 鞏磊;傅戈雁;陳治民;;快速成型與逆向工程技術(shù)及其在醫(yī)學中的應(yīng)用[J];新技術(shù)新工藝;2006年03期

6 余丹;劉建華;朱慧勇;李志勇;黃旭;魏棟;林軼;何劍鋒;趙文權(quán);;3-D打印技術(shù)在頜面骨缺損修復(fù)重建的應(yīng)用[J];中國修復(fù)重建外科雜志;2014年03期

相關(guān)博士學位論文 前1條

1 高東強;基于層合速凝原理的陶瓷件快速制造設(shè)備及材料成型研究[D];陜西科技大學;2012年

相關(guān)碩士學位論文 前1條

1 郭衛(wèi)衛(wèi);光固化快速成型中SiC晶須增強樹脂基復(fù)合材料的研究[D];中北大學;2009年

，

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