發(fā)布時(shí)間：2018-02-11 20:42

  本文關(guān)鍵詞： 聚芳醚腈 復(fù)合材料 表面改性 導(dǎo)熱性能 力學(xué)性能　出處：《電子科技大學(xué)》2015年碩士論文　論文類型：學(xué)位論文

【摘要】：聚芳醚腈[poly(arylene ether nitriles),PEN],作為一類綜合性能優(yōu)異的芳香雜環(huán)高分子聚合物,具有優(yōu)良的耐熱性、絕緣性、耐化學(xué)腐蝕及機(jī)械性能等,自其上世紀(jì)80年代初發(fā)明以來就受到廣泛關(guān)注。本實(shí)驗(yàn)室通過分子設(shè)計(jì)合成了一系列聚芳醚腈樹脂,并以此為基礎(chǔ)開展了結(jié)構(gòu)與性能、功能的研究,而有關(guān)聚芳醚腈的導(dǎo)熱性能卻少有研究。本文以端基交聯(lián)型聚芳醚腈(PEN-t-ph)作為基體,分別以改性Al2O3、石墨、碳納米管為導(dǎo)熱填料,通過溶液共混將填料填充到PEN-t-ph聚合物基體中。為了促進(jìn)填料-基體兩相的界面相容性,我們首先對無機(jī)填料進(jìn)行了表面改性,并采用掃描電子顯微鏡(SEM)、熱失重分析儀(TGA)、傅立葉變換紅外光譜儀(FTIR)、紫外吸收光譜分析儀(UV-Vis)以及X射線衍射儀(XRD)等儀器研究表征了改性填料表面形貌和結(jié)構(gòu)。最后利用連續(xù)超聲技術(shù)和溶液流延方法制備了導(dǎo)熱PEN-t-ph聚合物基復(fù)合材料,并分別研究了填料含量、填料改性、熱處理對復(fù)合材料的導(dǎo)熱性能、力學(xué)性能以及熱穩(wěn)定性等的影響。采用高導(dǎo)熱系數(shù)的無機(jī)填料填充聚合物材料可以明顯提高材料的導(dǎo)熱性能。實(shí)驗(yàn)結(jié)果表明,隨著改性Al2O3填料含量的增加,PEN-t-ph聚合物基復(fù)合材料的熱導(dǎo)率逐漸升高;將不同粒徑微米-納米混雜Al2O3按一定比例填充到PEN-t-ph樹脂中時(shí),復(fù)合材料表現(xiàn)出比填充單一Al2O3更優(yōu)異的導(dǎo)熱性能。用改性石墨填充PEN-t-ph,同樣也能改善PEN-t-ph材料的導(dǎo)熱性能,當(dāng)石墨的質(zhì)量分?jǐn)?shù)為16wt%時(shí),復(fù)合材料的熱導(dǎo)率是純樹脂的1.8倍;而且石墨經(jīng)過表面改性后,復(fù)合體系的導(dǎo)熱系數(shù)增加更加顯著。隨著導(dǎo)熱MWCNT-boehmite填料添加量的增加,改性PEN-t-ph復(fù)合材料的的熱導(dǎo)率初始變化緩慢;當(dāng)填料含量達(dá)到一定臨界值時(shí),材料的熱導(dǎo)率迅速增長。當(dāng)MWCNT-boehmite的填充量達(dá)到15wt%時(shí),復(fù)合材料的導(dǎo)熱系數(shù)是0.881 W/mK,約是純樹脂的2.7倍。伴隨復(fù)合材料熱導(dǎo)率上升的同時(shí),材料的力學(xué)性能不可避免的受填料含量的影響。當(dāng)填料含量較低時(shí),PEN-t-ph復(fù)合材料的力學(xué)性能隨著填料含量的增加而增加;繼續(xù)增加填料的含量,材料的力學(xué)性能又開始下降。無機(jī)填料的填充對復(fù)合材料的熱穩(wěn)定性影響很小,樣品初始分解溫度(Tid)和最大分解溫度(Tmax)范圍分別在490oC和520oC左右,材料保持了優(yōu)異的熱性能;此外復(fù)合材料的玻璃化轉(zhuǎn)變溫度(Tg)都在170oC以上。
[Abstract]:As a class of aromatic heterocyclic polymers with excellent comprehensive properties, poly(arylene ether nitriles-pen has excellent heat resistance, insulation, chemical corrosion resistance and mechanical properties. A series of poly (aryl ether nitrile) resins were synthesized by molecular design in our laboratory, and the structure, properties and functions of the resins were studied. However, the thermal conductivity of poly (aryl ether nitrile) was seldom studied. In this paper, the end group crosslinked polyether nitrile (PEN-t-ph) was used as the matrix, and the modified Al _ 2O _ 3, graphite and carbon nanotubes were used as thermal conductors, respectively. The filler was filled into the PEN-t-ph polymer matrix by solution blending. In order to promote the interfacial compatibility between the filler and the matrix, the inorganic filler was first modified. The surface morphology and structure of the modified fillers were characterized by scanning electron microscopy (SEM), thermogravimetric analyzer (TGA), Fourier transform infrared spectroscopy (FTIR), UV absorption spectrometer (UV-Vis) and X-ray diffractometer (XRD). The thermal conductive PEN-t-ph polymer matrix composites were prepared by continuous ultrasonic technique and solution flow casting method. The effects of filler content, filler modification and heat treatment on the thermal conductivity of composites were studied. The influence of mechanical properties and thermal stability. The thermal conductivity of polymer filled with inorganic fillers with high thermal conductivity can be improved obviously. The thermal conductivity of PEN-t-ph polymer matrix composites increased with the increase of the filler content of modified Al2O3, and when different particle size micron-nanometer hybrid Al2O3 was filled into PEN-t-ph resin in a certain proportion, The thermal conductivity of the composite is better than that of single Al2O3. The thermal conductivity of the composite filled with modified graphite can also improve the thermal conductivity of PEN-t-ph. When the mass fraction of graphite is 16 wt%, the thermal conductivity of the composite is 1.8 times that of pure resin. After surface modification, the thermal conductivity of the composite system increased more significantly, and the initial change of thermal conductivity of the modified PEN-t-ph composites was slow with the increase of the content of thermal conductive MWCNT-boehmite fillers, and when the filler content reached a certain critical value, the thermal conductivity of the modified PEN-t-ph composites changed slowly when the filler content reached a certain critical value. The thermal conductivity of the composites increases rapidly. When the MWCNT-boehmite content reaches 15 wt%, the thermal conductivity of the composites is 0.881 W / mK, about 2.7 times that of the pure resin, and the thermal conductivity of the composites increases with the increase of the thermal conductivity of the composites. When the filler content is low, the mechanical properties of PEN-t-ph composites increase with the increase of filler content. The mechanical properties of the composites began to decline again. The thermal stability of the composites was slightly affected by the filling of inorganic fillers. The initial decomposition temperature (Tid) and the maximum decomposition temperature (Tmax) of the samples were about 490 OC and 520 OC, respectively, and the thermal properties of the composites were excellent. In addition, the glass transition temperature (TG) of the composites is above 170 OC.
【學(xué)位授予單位】：電子科技大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TB33

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相關(guān)期刊論文 前1條

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本文編號：1503956